Risk of Mechanical Failure in PCB Assembly
Printed circuit boards (PCBs) are vital to the functionality of many electronic devices and systems. As a result, they must be free from defects to ensure that they perform their intended function. Unfortunately, no manufacturing process can be 100% flawless, so there are always a small number of failures that are unavoidable. However, there are a few key things that can be done to mitigate the risk of mechanical failure and to prevent it from happening again.
Despite the best of intentions, human error is a common cause of mechanical problems in pcb assembler. This can range from misplaced components to incorrect soldering. The good news is that with proper training and education, pcb assemblers can minimize their risk of error by adhering to strict quality control guidelines during production.
Exposure to environmental stressors can also weaken a PCB’s structural integrity. This can be caused by a variety of factors, including temperature fluctuations, moisture, and corrosive elements. These stresses can be mitigated by implementing shock-absorption materials, using reinforced mounting holes and stiffeners, and applying conformal coatings or encapsulation to protect against mechanical stress.
How to Mitigate the Risk of Mechanical Failure in PCB Assembly
Overheating of components due to inadequate cooling is another common cause of mechanical failure in PCB assembly. The problem can be caused by a wide range of factors, from improperly placed heat sinks to poor thermal management design. As a result, overheating can lead to shortened component lifespans, inconsistent performance, and even premature failure.
Low-quality components may deviate from design specifications or exhibit inconsistent performance, which can reduce the reliability and functionality of a PCB assembly. These defects can be caused by a number of factors, including substandard materials and inadequate quality control processes. To avoid these issues, pcb assemblers should use only high-quality components that meet rigorous industry standards and are tested to ensure quality.
During production, pcb assemblers use visual inspections to monitor the quality of their work. These inspections can include bright lighting, magnification, and pattern familiarity to identify defects such as scratch damages, discoloration, incorrect or missing components, and inconsistent soldering. The use of AOI (automated optical inspection) software can help pcb assemblers detect these defects more quickly and accurately than if they rely on manual inspection alone.
Besides visual inspections, a pcb assembler can also conduct X-ray inspections to check for closed internal solder voids, separation of material layers, contamination, and hidden fractures. Unlike visual inspection, which requires a high level of expertise, X-ray inspection is cost-effective and offers fast throughput. This can improve statistical yields by catching defective boards sooner, reducing the time and resources required to correct or scrap them.